In the pursuit of semiconductor device development and failure analysis, understanding material and device performance under extreme temperatures is crucial. Traditional testing methods, however, often fall short due to temperature limitations, failing to meet growing research and industrial demands.

The CPS-HT series high-temperature probe system delivers exceptional performance and flexible configurations, offering ideal solutions for various testing requirements. For research labs working with small samples under 2×2 inches (50×50 mm), the manual wafer probe station provides a cost-effective option with intuitive operation and rapid sample deployment. For automated production lines or large-scale R&D projects handling 100 mm or larger wafers, advanced motion control systems enable semi-automatic or fully automatic operation with high repeatability and efficiency.

The system's breakthrough temperature capabilities set it apart in the market. In vacuum environments, it supports testing up to 700°C, while maintaining stable 650°C operation in controlled atmospheric conditions. This enables researchers to:

• Investigate material electrical properties near melting points or phase transitions
• Precisely evaluate high-temperature device reliability
• Analyze failure mechanisms and thermal drift effects
• Conduct aging tests and thermal stress evaluations

The system incorporates several user-centric design features:

• Probe arms with external manual micro-adjusters for precise positioning
• Dual thermal stage options: air-cooled for standard testing and liquid nitrogen-cooled for rapid temperature cycling
• Standard 7:1 zoom microscope with <4μm resolution, with optional higher magnification lenses

The system addresses critical engineering challenges in high-temperature testing:

• Advanced vibration isolation to minimize interference from vacuum pumps
• Optimized heating/cooling cycles to protect samples and equipment
• Robust construction for long-term reliability in extreme conditions

This advanced testing platform provides researchers with unprecedented insights into material behavior under extreme conditions, enabling breakthroughs in semiconductor materials like silicon carbide (SiC) and gallium nitride (GaN). As semiconductor technology advances, the ability to accurately characterize device performance at high temperatures will become increasingly vital for innovation across multiple industries.